Industrial Memory Module

Our memory modules have
the best quality and support system for industrial use.

Quality

Product Specifications

Terminal surface processing to prevent contact failure of connector
Frictional resistance is reduced and making easier to connect when connecting to preventing damage to the connector terminal.

Electrolytic gold
The edge connector terminals are hard and rust-proof electrolytic gold-plated.Thicker than electroless gold plating, which also reduces the risk of poor connections.

BOM fixed
Fixed main components; DRAM, PCB, and SPD data

Warranty period

5 years warranty

4M・PCN

Customer will be informed 3 months in advance for 4M changes and PCN, and 6 months in advance for EOL.

Sustainability

Product Specifications

Multiple vendors adoption for components
Multiple vendors adoption for DRAMs to ensure stable supply.

Two manufacturing location

The products are manufactured in two factories in different countries. (Japan and Taiwan)
This allows to maintain production even if unexpected circumstances.
※ DDR3/DDR3L products are only manufactured in Taiwan.

RMA Support

RMA process (individual diagnosis) chart

As a general rule, individual diagnosis is executed in-house at HAGIWARA Solutions.

※１ The response time is counted from the date we receive RMA-covered product and receive permission from the customer to write or erase the data.
※２ Basic scope of RAM analysis ①Quality judgement ②Publish RMA report ③Product replacement during warranty period
※３ For detailed diagnosis of functional failures, there is a possibility that we will use the customer's host device for analysis.
※４ We will consult with the customer to determine the analysis method.

Other support

Document support

We provide product specifications, reliability test reports, RoHS certificates, and environmental documents (chem SHERPA).
We can prepare specified format designated by customer for environmental documents

Customization support

●Possible to specify the production factory.
※DDR4 products only

Memory Module Product Lineups

DDR3 Memory Module

Module Type ECC Operating Clock Pin Temperature Capacity Model Number
SO-DIMM ECC 1600MHz 204pin 0℃～85℃ 2GB FN12N-02GE(SE814L3
4GB FN12N-04GE(SF814L4
SO-DIMM Non ECC 1600MHz 204pin 0℃～85℃ 2GB FN12N002GL-*******
4GB FN12N004GL-*******
8GB FN12N008GL-*******
Module Type ECC Operating Clock Pin Temperature Capacity Model Number
U-DIMM ECC 1600MHz 240pin 0℃～85℃ 2GB FD12N-02GE(SE814L3
4GB FD12N-04GE(SE814L3
U-DIMM Non ECC 1600MHz 240pin 0℃～85℃ 2GB FD12N002GL-*******
4GB FD12N004GL-*******
8GB FD12N008GL-*******

DDR4 Memory Module

Module Type ECC Operating Clock Pin Temperature Capacity Model Number
SO-DIMM ECC 2133MHz 260pin 0℃～85℃ 4GB GN17N004GE-S5821L0
8GB GN17N008GE-S5821L0
16GB GN17N016GE-S6821L0
SO-DIMM ECC 2400MHz 260pin 0℃～85℃ 4GB GN19N004GE-S5821L0
8GB GN19N008GE-S5821L0
16GB GN19N016GE-S6821L0
SO-DIMM Ｎｏｎ ECC 2133MHz 260pin 0℃～85℃ 4GB GN17N004GN-*******
8GB GN17N008GN-*******
16GB GN17N016GN-S6821L0
SO-DIMM Ｎｏｎ ECC 2400MHz 260pin 0℃～85℃ 4GB GN19N004GN-*******
8GB GN19N008GN-*******
16GB GN19N016GN-S6821L0
SO-DIMM Ｎｏｎ ECC 2666MHz 260pin 0℃～85℃ 4GB GN21N004GN-*******
8GB GN21N008GN-*******
Module Type ECC Operating Clock Pin Temperature Capacity Model Number
U-DIMM ECC 2133MHz 288pin 0℃～85℃ 4GB GD17N004GE-S5821L0
8GB GD17N008GE-S5821L0
16GB GD17N016GE-S6821L0
U-DIMM ECC 2400MHz 288pin 0℃～85℃ 4GB GD19N004GE-S5821L0
8GB GD19N008GE-S5821L0
16GB GD19N016GE-S6821L0
U-DIMM Ｎｏｎ ECC 2133MHz 288pin 0℃～85℃ 4GB GD17N004GN-*******
8GB GD17N008GN-*******
16GB GD17N016GN-S6821L0
U-DIMM Ｎｏｎ ECC 2400MHz 288pin 0℃～85℃ 4GB GD19N004GN-*******
8GB GD19N008GN-*******
16GB GD19N016GN-S6821L0
U-DIMM Ｎｏｎ ECC 2666MHz 288pin 0℃～85℃ 4GB GD21N004GN-*******
8GB GD21N008GN-*******
16GB GD21N016GN-*******
Where * is any alphanumeric number or character for DRAM. Please contact us for details.
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